K. Pozun
Institut za elektroniko in
vakuumsko tehniko
1111 Ljubljana, Teslova 30
J. Leskovsek, L. Koller, M. Mozetic, IEVT
Ljubljana
Preiskovali smo vpliv razlicnih postopkov ciscenja kontaktnih
materialov na kontaktno upornost mirujocih, preklopnih in drsnih
kontaktov. Preucevali smo dve metodi ciscenja: ciscenje s freoni
(FCHC) in nizko-temperaturno ciscenje v reduktivni plazmi.
Uporabili smo materiale za profesionalno elektroniko ter na njih
merili kontaktno upornost odvisno od sile med kontaktnimi
trakovi. Vse meritve so bile racunalnisko vodene na sistemu, ki
smo ga razvili in izdelali v nasem laboratoriju.
Kljucne besede: kontaktna upornost, kontaktna sila, ciscenje s
freoni, ciscenje v reduktivni plazmi
The influence of surface cleaning of contact materials on the
contact resistance of stationary and slidig electrical contacts
was investigated. For preparation of contact materials the two
cleaning methods were studied: cleaning with FCHC and low
temperature cleaning in reductive plasma. Well known contact
materials for professional electronics were used, and the contact
resistance in dependence to force was measured on them. All
measurements were performed with a computer controlled system,
constructed and developed in our laboratory.
Key words: contact resistance, contact force, cleaning with FCHC,
cleaning in reductive plasma